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UCIe™
Universal Chiplet Interconnect Express™
Building an open ecosystem of chiplets
for on-package innovations
Our Services
Announcing UCIe 2.0 Specification Release! LEARN MORE
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UCIe™ — Universal Chiplet Interconnect Express™ — addresses customer requests for a more customizable, package-level integration — combining best-in-class die-to-die interconnect and protocol connections from an interoperable, multi-vendor ecosystem.
This new open industry standard establishes a universal interconnect at the package-level.
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Contact Us
For more information on UCIe™ or to learn how to get involved, please complete the following form or contact [email protected].
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